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The influence of physical and chemical linkage on the properties of nanocomposites

Roy, M., Nelson, J. K., Schadler, L. S. , Zhou, C. & Fothergill, J. (2005). The influence of physical and chemical linkage on the properties of nanocomposites. In: Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, 16 - 19 October 2005, Nashville, USA.

Abstract

It has been shown by several groups that the mechanical and electrical behavior of composites changes quite substantially, and often beneficially, when the filler particle size is less than 100 nm in diameter. There is also good reason to believe that the interface between the embedded particulates and the polymer matrix holds the key to understanding the bulk phenomena observed. Materials based on an SiO2-polyolefin system have been formulated with functionalized particulates so as to affect the physical and chemical linkages. The agents used to achieve this include amino-silane, hexamethyl-disilazane and triethoxyvinylsilane. The emerging picture of the interface is supported by detailed dielectric spectroscopy and internal space charge assessment. The nature of the internal structure has been related to the bulk properties observed such as the breakdown strength, voltage endurance, and the measurement of internal charges resulting from interfacial polarization.

Publication Type: Conference or Workshop Item (Paper)
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Departments: Presidents's Portfolio
School of Science & Technology > Engineering
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