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Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques

Chen, X., Shaw, C., Gelman, L. and Grattan, K. T. V. ORCID: 0000-0003-2250-3832 (2019). Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques. Measurement, 139, pp. 387-402. doi: 10.1016/j.measurement.2019.03.026

Abstract

In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed.

Publication Type: Article
Additional Information: © Elsevier 2019. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/
Publisher Keywords: interface adhesion, bond strength; coating-substrate system; minimum-destructive testing
Subjects: T Technology > TJ Mechanical engineering and machinery
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Departments: School of Mathematics, Computer Science & Engineering > Engineering > Electrical & Electronic Engineering
URI: http://openaccess.city.ac.uk/id/eprint/21839
[img] Text - Accepted Version
This document is not freely accessible until 11 March 2020 due to copyright restrictions.
Available under License Creative Commons Attribution Non-commercial No Derivatives.

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