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Development of an intraluminal intestinal photoplethysmography sensor

Patel, Z., Thaha, M. A. & Kyriacou, P. A. (2017). Development of an intraluminal intestinal photoplethysmography sensor. Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS, pp. 1840-1843. doi: 10.1109/EMBC.2017.8037204


Intestinal ischemia is a serious medical condition and can lead to life threatening sepsis. Currently, there are no reliable techniques available for directly monitoring intestinal viability for prolonged periods of time, and intraoperatively, the majority of the surgeons still rely on subjective methods, such as visual inspection to assess viability of the intestine. The development of an intraluminal optical sensor for monitoring intestinal viability is being proposed. The sensor will continuously monitor changes in blood volume and oxygen saturation. The developed reflectance photoplethysmography/pulse oximetry sensor comprises of two emitters (red and infrared) and a photodiode. A photoplethysmography processing and data acquisition system was also utilized. The prototype sensor was evaluated in a pilot study in the buccal mucosa of 12 healthy volunteers, given the locations similarity to the intestinal mucosa and its easy accessibility. Good quality photoplethysmography signals with high signal-to-noise ratio were acquired from the buccal mucosa in all the volunteers. Preliminary blood oxygen saturation values from the intraluminal sensor were in broad agreement with the standard finger pulse oximeter probes.

Publication Type: Article
Additional Information: © 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Departments: School of Science & Technology > Engineering
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