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Thermo-physical characteristics of 3C-SiC structure subjected to microwave exposure: A molecular dynamics study

Doran, T., Owhal, A., Roy, T. , Belgamwar, S. U., Goel, S., Yazdani Nezhad, H. ORCID: 0000-0003-0832-3579 & Mishra, R. (2023). Thermo-physical characteristics of 3C-SiC structure subjected to microwave exposure: A molecular dynamics study. Materials Today Communications, doi: 10.1016/j.mtcomm.2023.105693

Abstract

Silicon carbide (SiC) is widely used as a susceptor for microwave hybrid heating applications owing to its exceptional microwave absorbing characteristics. In practice, it is challenging to characterize the thermo-physical behaviour of the microwave irradiated SiC-based targets experimentally due to interference of integrated measurement devices with microwaves. In this article, molecular dynamics simulations were performed to understand the atomistic response of a bulk 3C-SiC model during microwave heating. Atomistic simulations were performed at different electric field strengths (ranging from 0.1 to 0.5 V/Å) and frequencies (ranging from 100 to 500 GHz) to develop a numerical relationship between temperature and time in order to predict the thermal response of bulk 3C-SiC. On the other hand, the physical characteristics of the bulk 3C-SiC were determined by the plots between mean square displacement (MSD), time and diffusion coefficients. The results showed that at 0.5 V/Å electric field strength and 500 GHz frequency, the diffusion coefficient increased up to 88% as compared to the electric field strength of 0.1 V/Å at 500 GHz. A change of 75% in the physical phase of 3C-SiC structure with respect to the initial structure was confirmed by the distorted density distribution profile.

Publication Type: Article
Additional Information: © 2023. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Departments: School of Science & Technology > Engineering
[img] Text - Accepted Version
This document is not freely accessible until 23 February 2024 due to copyright restrictions.
Available under License Creative Commons Attribution Non-commercial No Derivatives.

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