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Items where Author is "Zhou, H."

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Article

Zhou, H., Fu, F. ORCID: 0000-0002-9176-8159, Si, B. (2024). Design of Prestressed Cable Dome Using Minor Perturbation Method. Buildings, 15(1), article number 114. doi: 10.3390/buildings15010114

Steinmetz, J. D., Seeher, K. M., Schiess, N. (2024). Global, regional, and national burden of disorders affecting the nervous system, 1990–2021: a systematic analysis for the Global Burden of Disease Study 2021. The Lancet Neurology, 23(4), pp. 344-381. doi: 10.1016/s1474-4422(24)00038-3

Fan, Z., Xiao, X. ORCID: 0000-0002-0564-9795 & Zhou, H. (2022). Moment Risk Premia and Stock Return Predictability. Journal of Financial and Quantitative Analysis, 57(1), pp. 67-93. doi: 10.1017/s002210902000085x

Zhou, H., Suo, L., Peng, Y-P. (2022). Micro-Tapered Fiber Few-Mode Interferometers Incorporated by Molecule Self-Assembly Fiber Grating for Temperature Sensing Applications. Photonics, 9(2), article number 96. doi: 10.3390/photonics9020096

Liu, Z., Tong, L., Chen, L. (2021). CANet: Context Aware Network for Brain Glioma Segmentation. IEEE Transactions on Medical Imaging, 40(7), pp. 1763-1777. doi: 10.1109/tmi.2021.3065918

Zhang, L., Tian, Z., Chen, N-K. (2020). Room-Temperature Power-Stabilized Narrow-Linewidth Tunable Erbium-Doped Fiber Ring Laser Based on Cascaded Mach-Zehnder Interferometers with Different Free Spectral Range for Strain Sensing. Journal of Lightwave Technology, 38(7), pp. 1966-1974. doi: 10.1109/jlt.2020.2971666

Zhou, H., Zhang, Y., Fu, F. ORCID: 0000-0002-9176-8159 (2020). Collapse Mechanism of Single-Layer Cylindrical Latticed Shell under Severe Earthquake. Materials, 13(11), article number 2519. doi: 10.3390/ma13112519

Zhou, H., Zhang, Y., Fu, F. (2018). Progressive Collapse Analysis of Reticulated Shell under Severe Earthquake considering the Damage Accumulation Effect. Journal of Performance of Constructed Facilities, 32(2), article number 04018004. doi: 10.1061/(asce)cf.1943-5509.0001129

Iqbal, S., Zhang, L., Fu, X. (2018). Highly-efficient low cost anisotropic wet etching of silicon wafers for solar cells application. AIP Advances, 8(2), article number 025223. doi: 10.1063/1.5012125

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