Electromagnetic and thermal analyses of high performance magnetic shape memory actuators for valve applications
Gabdullin, N. & Khan, S. (2016). Electromagnetic and thermal analyses of high performance magnetic shape memory actuators for valve applications. IEEE Transactions on Magnetics, 52(9), pp. 1-6. doi: 10.1109/tmag.2016.2563406
Abstract
Magnetic shape memory (MSM) alloys are relatively new “smart” alloys which have enormous potential to be used in actuators, sensors and other electrical devices. Their large strain and considerable stress output can be controlled by magnetic fields or mechanical stresses. Maximum magnetic field-induced strain varies from 6 to 12% of the MSM element’s length depending on its microstructure. However, very low operational temperature limit is one of the main drawbacks of conventional MSM alloys. This makes their application in high performance actuators challenging due to considerable power losses. This paper discusses different MSM actuator designs optimized particularly for large force output for pneumatic electromagnetic (EM) valve applications. The thermal problem is addressed through analyzing the heat transfer conditions of each particular design and the effects of different cooling systems. An energy-efficient operating cycle for varying actuator load that takes advantage of the shape memory effect is also proposed. This allows minimization of energy losses resulting in acceptable increase in temperature ensuring stable continuous actuation.
Publication Type: | Article |
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Additional Information: | © 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
Publisher Keywords: | Actuator design; magnetic shape memory alloys; electromagnetic analysis; thermal analysis; smart materials. |
Subjects: | Q Science > QC Physics T Technology > TK Electrical engineering. Electronics Nuclear engineering |
Departments: | School of Science & Technology > Engineering |
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