Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques
Chen, X., Shaw, C., Gelman, L. & Grattan, K. T. V. 
ORCID: 0000-0003-2250-3832 (2019).
Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques.
Measurement, 139,
pp. 387-402.
doi: 10.1016/j.measurement.2019.03.026
Abstract
In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed.
| Publication Type: | Article |
|---|---|
| Additional Information: | © Elsevier 2019. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/ |
| Publisher Keywords: | interface adhesion, bond strength; coating-substrate system; minimum-destructive testing |
| Subjects: | T Technology > TJ Mechanical engineering and machinery T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Departments: | School of Science & Technology > Engineering |
| SWORD Depositor: |
Available under License Creative Commons Attribution Non-commercial No Derivatives.
Download (2MB) | Preview
Export
Downloads
Downloads per month over past year
Metadata
MetadataActions (login required)
Admin Login