City Research Online

Abstract

III-V materials with quantum wells or quantum dot active regions have proven to be relatively efficient devices for amplifying light. However, integration and scaling of many other functions are moving towards the development of ever more complex photonic integrated circuits (PICs). Assembling these devices into hybrid/heterogeneous PICs poses a challenge in terms of bandwidth and footprint. In this work, we propose a Particle Swarm Optimized methodology to generate non-intuitive structures that couple light vertically from a III-V platform to a silicon-on-insulator chip. By designing heuristically optimized III-V and silicon tapers, we can overcome the limitations of typical linearly-varying spot-size converters in terms of footprint, without sacrificing bandwidth. Furthermore, the optimization parameters are adjusted to fit the usual design rule constraints that are ready for mass production, namely UV-lithography limits.

Publication Type:	Article
Additional Information:	Copyright 2021, Society of Photo‑Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this publication for a fee or for commercial purposes, and modification of the contents of the publication are prohibited.
Publisher Keywords:	spot-size converter, optical interconnects, hybrid silicon photonics
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Departments:	School of Science & Technology > Engineering

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